(footprint "CUI_UJC-HP-3-SMT-TR" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (descr "USB Connectors USB jack, C type, power only, 6 pin, horizonal, gold flash plating, surface mount, T&R\n")
  (tags "USB-C, Power, USB")
  (attr smd)
  (fp_text reference "REF**" (at -3.5 -1.8) (layer "F.SilkS")
      (effects (font (size 0.787402 0.787402) (thickness 0.15)))
    (tstamp fcf8be7f-56e1-4fac-9032-845fd53b875e)
  )
  (fp_text value "CUI_UJC-HP-3-SMT-TR" (at 0.1 7.3) (layer "F.Fab")
      (effects (font (size 0.787402 0.787402) (thickness 0.15)))
    (tstamp 9fbf1a9c-7de6-4422-98b2-28bfd82f4e2e)
  )
  (fp_text user "${REFERENCE}" (at -2.8 3.2 unlocked) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)) (justify left bottom))
    (tstamp 494a1375-2afb-4904-85b6-fca45fbcd200)
  )
  (fp_line (start -4.47 2.45) (end -4.47 1.35)
    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 92f69cf0-af3b-4129-bdc9-1cf73908efbb))
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    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 2c95434e-c5c2-43ec-8099-2c30b4d5895d))
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    (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp f5f76f6f-194b-467b-97ef-e076c3f63340))
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    (stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 67eda45d-afbf-481f-96ec-315074befae2))
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    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 4ba21e52-d148-4de2-a88c-51de9570c29c))
  (pad "A5" smd rect (at -0.5 -0.005 90) (size 1.15 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp e194ec2e-14ef-4f50-b003-defbe9323d55))
  (pad "A9" smd rect (at 1.52 -0.005 90) (size 1.15 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp e1cfca70-2c30-4017-a999-0fa8a42993e4))
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    (solder_mask_margin 0.102) (tstamp 5f9b5bdb-3ec5-468c-b45c-c356a2912895))
  (pad "B5" smd rect (at 0.5 -0.005 90) (size 1.15 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp e8667893-0376-4f0c-acfc-25ae9fceedb4))
  (pad "B9" smd rect (at -1.52 -0.005 90) (size 1.15 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp ad1fb2e4-d1b8-4107-9f24-4fa1ce185013))
  (pad "B12" smd rect (at -2.75 -0.005 90) (size 1.15 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.102) (tstamp 48b96b29-0c0f-4959-a3c6-51b5a316803e))
  (pad "S1" thru_hole oval (at -4.32 0) (size 1 2) (drill oval 0.5 1.2) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp f28d56d7-3fbc-448d-8cdf-066f7d3eaf3b))
  (pad "S2" thru_hole oval (at 4.32 0) (size 1 2) (drill oval 0.5 1.2) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp a48b7cd5-c1a9-4768-9398-300357cabf74))
  (pad "S3" thru_hole oval (at -4.32 3.8) (size 1 2) (drill oval 0.5 1.2) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp baa39a81-4e58-492b-85d0-5192368399b3))
  (pad "S4" thru_hole oval (at 4.32 3.8) (size 1 2) (drill oval 0.5 1.2) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp cc92a888-d455-4083-ac01-3acc173628aa))
)
